Prevencia

Pure tin finishes risk conductive whiskers (>1mm growth). Mitigation: Matte Sn coatings with >3% pb (oslobodené od ROHS), Ni Underlayers (1-3 μm) alebo Conformal Coating {{}} Accelerated Testing (85 stupňov /85% RH pre 4, {} a121} HRS) platí Metódy . Aerospace Applications vyžadujú SNPB Solders . Research: Atómová vrstva depozície bariér hlinitého .